QuantumSeedScaling requires every layer to move together
The next frontier in deep tech isn’t just about breakthrough technology. It’s about who can scale it.
At ECOC 2026, ams OSRAM and BizLink demonstrated a connectorized multi-core fiber link driven by 850nm thin-film microVCSEL arrays.
What caught my attention is the “wide-and-slow” architecture — using many parallel, lower-speed optical lanes rather than relying on a few complex high-speed channels.
With 25 μm-pitch microVCSEL arrays, silicon TSV integration, and a roadmap toward 3D stacking with mixed-signal CMOS, this is more than an optical interconnect innovation. It highlights the importance of semiconductor manufacturing, advanced packaging, and system-level integration.
Near-term AI demand, a potential quantum connection
The immediate opportunity is AI infrastructure, particularly high-density, energy-efficient optical connectivity.
I also see a potential connection to quantum computing, where scaling qubit control and readout will require increasingly sophisticated, low-power classical interconnect infrastructure. Whether these specific optical approaches can be adapted remains an open technical question.
Different technologies. Shared infrastructure challenges.
That’s where I see compelling opportunities for investment and cross-border industry collaboration.
Read the Original Post on LinkedIn ↗
← All Founder's Insights